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ProductsMemoryW25Q64JVXGIQ
PACKAGE REFERENCEXSON-8 (4x4 mm)Confirm case, pinout and ordering suffix before purchase.
MANUFACTURER PART RECORD

W25Q64JVXGIQ

Winbond

The W25Q64JVXGIQ packs 64M-bit (8M-byte) of JV-generation SpiFlash serial NOR memory into a leadless XSON-8 package measuring only 4 x 4 mm. Standard, Dual and Quad SPI run at up to 133 MHz with Continuous Read for execute-in-place boot, the supply spans 2.7 V to 3.6 V, and the device guarantees at least 100,000 program/erase cycles per 4 KB sector with retention beyond 20 years, plus SFDP parameters and a 64-bit unique ID. Choose this XG code when a wearable, compact IoT or camera-module design cannot afford an SOIC or WSON footprint but needs full JV performance; the same silicon is available in SOIC-8 and WSON packages under other order codes if the layout later changes. Note that leadless XSON packages need an assembly inspection strategy suited to hidden joints. Parameters verified against Winbond documentation.

MemorySpiFlash Serial NOR FlashXSON-8 (4x4 mm)
MPN
W25Q64JVXGIQ
Manufacturer
Winbond
Family
SpiFlash Serial NOR Flash
Package
XSON-8 (4x4 mm)
Manufacturer channel coverage
Checked by RFQ
Data last checked
Commercial check required
Required order checks
Suffix, package, date code, lot, source and traceability
QUOTE WORKFLOW

Four checks before a commercial offer.

01

Identity

Exact MPN, manufacturer and suffix

02

Supply

Supplier type, quantity and freshness

03

Evidence

Lot, labels, photos and documents

04

Terms

Price, lead time, payment and shipping

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