Winbond
3 component profiles — every part number below links to its full reference record with datasheet, specifications and RFQ.
Winbond is the volume leader in serial NOR flash, and the three profiles here cover the densities used for code storage and data logging in embedded designs. Serial flash ordering codes specify density, interface (SPI or quad SPI), voltage and package — confirm all four against the host controller requirements. For long-life products, check product longevity commitments and process-change notifications, since flash migrations are among the most common forced redesigns in this category.
Sourcing notes for Winbond parts. Always quote the complete manufacturer ordering code — package, temperature grade, speed or accuracy grade, and packing (reel, tube or tray) all change availability and price, and suffixes are where most mismatches happen. Check the lifecycle status on the manufacturer site before committing to a multi-year build; parts flagged not-recommended or obsolete need a last-time-buy plan or a verified alternate lined up early. With every offer, request traceability documents — date code, lot code and original packing — and confirm the inspection steps your supplier applies to high-risk lots.
All Winbond parts (3)
| MPN | Function | Package | Record |
|---|---|---|---|
| W25Q128JVSIQ | 128Mb SPI NOR Flash | SOIC-8 | View → |
| W25Q32JVSSIQ | 32Mb SPI NOR Flash | SOIC-8 | View → |
| W25Q64JVSSIQ | 64Mb SPI NOR Flash | SOIC-8 | View → |
Winbond by category
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