W25N04KVZEIR

W25N02KVZEIR is a Winbond 2Gb (256M x 8) SLC QspiNAND Flash in 8-pin WSON (8x6mm) — the sweet-spot density for connected-device firmware: Wi-Fi modules, smart meters, POS terminals and industrial sensors that outgrow SPI NOR but do not need 4Gb. 2.7V to 3.6V with SPI/Quad I/O at up to 104MHz, 2KB pages, on-chip ECC and bad block management LUT, 60K program/erase cycles and 10-year retention. Selection advice: like its 4Gb sibling W25N04KVZEIR this is the 3V KV series — for 1.8V designs use the W25N02KW family instead; the 2Gb density is the most multi-sourced serial NAND size (Winbond, GigaDevice GD5F2GM7, Macronix), so always dual-source it and let price and lead time compete. 700µs typical page program is slower than NOR — size your firmware-update window accordingly. Parameters verified against Winbond documentation and distributor listings. State quantity, packing and date-code requirements in your RFQ; we reconfirm the offered lot before quotation and reply within 24 hours.

W25N512GVZEIG is a Winbond 512Mb SLC QspiNAND Flash in WSON-8 — the entry density for serial NAND migration: designs moving up from 256Mb SPI NOR get 4x the bits in the same 8-pin footprint and QSPI command set. 2.7V to 3.6V (GV = 3V series) with SPI/Quad I/O at up to 104MHz, continuous and sequential read modes, on-chip 1-bit ECC and bad block management. Selection advice: 512Mb is the classic NOR-to-NAND crossover point — below it NOR is simpler, above it NAND wins on cost per bit; if your firmware already handles NAND bad blocks, this is the cheapest path to 64MB. For 1.8V rails use the W25N512GW (1.8V twin) instead of the 3V GV. As the oldest shipping QspiNAND density it is the most broadly stocked — check date codes on spot lots. Parameters verified against Winbond documentation. State quantity, packing and date-code requirements in your RFQ; we reconfirm the offered lot before quotation and reply within 24 hours.

W25N01GVZEIG is a Winbond W25N01GV 1-Gbit serial (SPI/Quad SPI) SLC NAND flash — 128M × 8 organization, 2.7 to 3.6 V supply, up to 104 MHz clock, in 8-pin WSON (8 × 6 mm), tray packing (IG suffix), -40 to +85 °C. On-chip ECC, bad-block management and a 2 KB page size are the selection point: NAND density at SPI simplicity for data logging, audio/image storage and firmware backup where SPI NOR would cost far more per bit. Selection advice: this is SPI NAND, not SPI NOR — it needs ECC and bad-block handling (handled on-chip here) and does not execute code in place, so for XIP boot use SPI NOR (W25Q family) instead. Important lifecycle note: Mouser and Arrow list this exact ordering code as End of Life / Obsolete — do not design it into new products without confirming supply; for new designs check the W25N01GW/JW successors. For existing builds, confirm lot availability and date code at RFQ. Evidence: Winbond datasheet and Mouser/Arrow listings confirm 1 Gbit, SPI/Quad, 2.7-3.6 V, 104 MHz, WSON-8 and the EOL status. Match the full W25N01GVZEIG code. State quantity, packing and date-code requirements in your RFQ; we reconfirm the offered lot before quotation and reply within 24 hours.

The Winbond W25Q01JV is the highest-capacity device in the W25Q serial NOR Flash family at 1 Gbit, built on a uniform 4 KB sector architecture with Dual/Quad SPI interfaces running up to 133 MHz, a 2.7 V–3.6 V supply range, and an industrial temperature range of -40°C to +85°C. As the flagship capacity of the series, a single chip carries the full 1 Gbit of code storage, simplifying the BOM and PCB layout versus multi-chip cascaded schemes; the uniform 4 KB sectors make erase management finer and firmware upgrades more flexible, while high-speed Quad SPI read supports execute-in-place (XIP) and code shadowing for shorter system boot times. Winbond lists the device as Status=P (in production), so supply is stable for long-lifecycle industrial control, networking, and smart-terminal projects. Selection advice: if code size exceeds 512 Mb but has not reached multi-gigabit territory, the W25Q01JV is the direct step-up from the W25Q512JV with no interface change; note it is a 3 V device — 1.8 V low-power systems should pick a 1.8 V series instead; space-constrained designs can choose the TFBGA-24 6×8 mm package. Parameters verified against Winbond documentation. State quantity, packing and date-code requirements in your RFQ; we reconfirm the offered lot before quotation and reply within 24 hours.

The Winbond W25Q02JVTBIM is a 2 Gbit (256 MB) QSPI NOR Flash built on a stacked four-die × 512 Mbit architecture, with uniform 4 KB sectors, Standard/Dual/Quad SPI plus DTR (double transfer rate) modes, clocks up to 133 MHz (532 MHz equivalent in Quad mode), a 2.7 V–3.6 V supply, an industrial temperature range of -40°C to +85°C, and a 24-ball TFBGA 8×6 mm package. As the largest-capacity device in the W25Q family, a single chip covers large-code applications such as complex GUIs and OTA dual-image backup without external storage; DTR doubles effective throughput, so code shadowing and XIP run more smoothly. Winbond's official W25Q02JV datasheet (RevD, DTR) lists this exact part number in the ordering table as a valid in-production device. Selection advice: it is the direct step-up from the 1 Gb W25Q01JV with an interface-compatible footprint; note it is a 3 V device; the TFBGA package suits high-density layouts. Parameters verified against Winbond documentation. State quantity, packing and date-code requirements in your RFQ; we reconfirm the offered lot before quotation and reply within 24 hours.

W25Q128JVSIQ is a 128 Mb serial NOR Flash memory from Winbond in an 8-pin SOIC package, for code and data storage in embedded systems — firmware images, configuration tables and data logging. Its advantage is the standard SPI interface and JEDEC-compatible footprint, which keeps the memory subsystem interchangeable across controller platforms and simplifies second-sourcing. Selection advice: flash holds your firmware, so this is the wrong part to buy on price alone — confirm the exact 128 Mb density code and require date-code traceability, because wrong-density or remarked flash causes field failures that are expensive to recall. The SIQ suffix pins the SOIC-8 package; state whether you need blank or pre-programmed devices in your RFQ. We reconfirm manufacturer, density code, lot and traceability against the offered lot before quotation and reply within 24 hours.

W25Q256JVEIQ is a Winbond 256Mbit serial NOR flash — for code storage and data logging in embedded systems: Quad SPI interface up to 133MHz, 2.7V to 3.6V supply, 8-WSON (8x6mm) package, -40°C to 85°C industrial range, 100,000 program/erase cycles. The 256Mbit density stores full firmware images with room for A/B update partitions, so field updates don't brick the device if power fails mid-write; Quad SPI at 133MHz delivers execute-in-place performance that rivals parallel NOR at a fraction of the pin count. Business impact: Winbond's SpiFlash family is the de facto standard for embedded code storage — second-source risk is minimal and driver support is universal across MCUs and SoCs. Selection advice: the VEIQ code denotes the 8-WSON package — for SOIC-16 compatibility consider the VSIG variant; the JV series is the mainstream choice — for 1.8V systems, look at the W25Q256JW family instead. Ranked #20 on the Chuangxin Index June 2026 hot-search list (13,450 searches, +57.66% MoM). Parameters verified against Winbond documentation. State quantity, packing and date-code requirements in your RFQ; we reconfirm the offered lot before quotation and reply within 24 hours.

W25Q256JVSIQ is a Winbond 256Mb (32M x 8) Serial NOR Flash in SOIC-8 — for large firmware images and execute-in-place code where NAND page management is unwanted: industrial controllers, networking gear and automotive modules. 2.7V to 3.6V with SPI/Quad I/O at up to 133MHz, 4KB sectors for flexible parameter storage, and XiP support so MCUs boot directly from flash. Selection advice: the SIQ suffix pins the SOIC-8 208mil industrial package — for tighter layouts the WSON-8 EIQ code is the smaller twin; at 256Mb you are at the top of cost-effective NOR — beyond this density compare serial NAND (W25N series) on cost per bit, since NOR stops scaling economically. In the current memory tightness, 256Mb NOR is a frequent allocation pinch point — confirm lot traceability rather than accepting remarked stock. Parameters verified against Winbond documentation and distributor listings. State quantity, packing and date-code requirements in your RFQ; we reconfirm the offered lot before quotation and reply within 24 hours.

W25Q32JVSSIQ is a Winbond 32 Mb serial NOR Flash memory in SOIC-8, tube — for firmware images, boot code and configuration storage in embedded systems. Quad-SPI reads up to 133 MHz with 2.7 V to 3.6 V operation across the −40 °C to +85 °C industrial range is the selection point: fast execute-in-place reads for MCUs that boot directly from flash. Selection advice: match the 32 Mb density code exactly — firmware images are built for a specific flash size, and a wrong-density substitute causes boot failures that look like hardware faults. Lifecycle note: Mouser flags this exact ordering code as End of Life (scheduled for obsolescence) while other channels still list it Active — treat it as legacy: require lot and date-code traceability, state whether you need blank or pre-programmed devices, and ask about the newer W25Q32JW series as the forward path in your RFQ. Parameters verified against distributor documentation. We reconfirm manufacturer, density code, lot and traceability against the offered lot before quotation and reply within 24 hours.

W25Q512JVFIQ is a Winbond 512Mb (64M x 8) Serial NOR Flash in SOIC-16 300mil — the top density for execute-in-place firmware where SPI NAND page management is unwanted: large industrial controllers, networking appliances and automotive gateway modules. 2.7V to 3.6V with SPI/Dual/Quad I/O at up to 133MHz (532MHz equivalent quad), 4KB sectors, 64-bit unique serial number and three 256-byte security registers; DTR and QPI modes available per the JV-DTR datasheet. Selection advice: the FIQ suffix pins the SOIC-16 300mil industrial package — for space-constrained layouts the WSON-8 EIQ code is the smaller twin, and the TFBGA-24 BIQ suits BGA designs; at 512Mb this is the ceiling of economical NOR — beyond it, serial NAND (W25N series on this site) wins decisively on cost per bit. In the current memory tightness, 512Mb NOR faces allocation pressure — confirm lot traceability and require date codes rather than accepting remarked stock. Parameters verified against Winbond documentation. State quantity, packing and date-code requirements in your RFQ; we reconfirm the offered lot before quotation and reply within 24 hours.

Micron has committed over 75% of its 2027 output to long-term agreements — 26 LTAs, $32B in customer deposits, $150B in remaining obligations. What got locked, how it squeezes spot buyers, and five procurement moves.

Reports say Apple agreed to a multi-year NAND deal with Kioxia with no price cap — 'lock volume first, argue price later' becomes the industry playbook. What was reported, why Apple did it, and three signals for ordinary buyers.

CXMT is building a NAND R&D line while YMTC samples DRAM — China's memory 'division of labor' is breaking down. What was reported, when supply could be real, and three practical takeaways for buyers.