VD1943CE/RW

VD1943CE/RW is the bare-die ordering code for the STMicroelectronics VD1943 BrightSense image sensor — the same 5.1 megapixel (2560 × 1984) RGB-NIR silicon as the packaged device, delivered as die on a reconstructed wafer (the /RW form) for camera-module makers that bond and package the sensor into their own optical stack. Do not read this page with the packaged part's parameters: there is no OBGA package here, so package dimensions, ball map and reflow guidance from the packaged code do not apply — die dimensions, pad layout and wafer packing must be taken from the VD1943 bare-die documentation set. The silicon itself carries the BrightSense hybrid shutter: global shutter captures motion-artifact-free frames at up to 100 fps at full resolution, rolling shutter mode delivers low-noise imaging with on-chip HDR reconstruction, the 2.25 µm BSI pixels sit in a 1/2.5-inch optical format, output runs over MIPI CSI-2 and an integrated ISP performs RGB-IR separation so one sensor returns both color and NIR images. Selection advice: order VD1943CE/RW only if your line handles wafer-level die attach and optical assembly; for a ready-to-mount sensor choose the packaged sibling VB1943CAJX/1 (also listed on this site), and for monochrome bare die see VD5943CE/RW. Parameters verified against STMicroelectronics documentation.