XCZU3EG-1SFVC784E

XCZU3EG-1SFVC784E is a Zynq UltraScale+ EG MPSoC from AMD in a 784-ball FCBGA package — quad Arm Cortex-A53 application processors up to 1.5 GHz, dual Cortex-R5F real-time cores, Mali-400 MP2 GPU and 154K system logic cells of 16 nm FinFET+ programmable fabric on one die. The heterogeneous integration is the selection point: application processing, real-time control, graphics and FPGA acceleration collapse into a single device, cutting BOM line items, board area and chip-to-chip interface risk versus multi-chip assemblies. Business impact: the ZU3EG is the de-facto standard silicon for AI-at-the-edge vision products, so buyers inherit a deep ecosystem of SOMs, carriers and reference software instead of starting from bare metal. The Ultra96-V2, AMD Kria K24 SOM and Digilent Genesys ZU-3EG development platforms are all built on the XCZU3EG — three independent commercial platforms on the same die, with active machine-vision, ADAS and smart-camera design activity. Selection advice: the -1 speed grade and SFVC784 package must match your design; EG means quad-A53 plus Mali GPU — if you need the hardened H.264/H.265 video codec, step up to the EV line (e.g. ZU7EV); budget Vivado and PetaLinux/EDF tooling in your schedule. Confirm PS/PL partitioning and I/O needs against the AMD datasheet. Parameters verified against AMD documentation.