What is happening (the short version)

October 2026 brings a fresh wave of power-semiconductor price increases. Securities Times reports onsemi's new pricing takes effect October 10; Taiwan-based power makers (TSC, Panjit and peers) are reportedly raising prices ~10%–15% on non-contract (spot) products starting in October, according to supply-chain reports, with MOSFETs as the named focus of this round. If you own a BOM covering power supplies, motor drives, industrial or server hardware, confirming your Q4 and 2027-Q1 MOSFET usage and getting quotes out within October may help you lock prices before the reported adjustments take effect. All pricing and price-adjustment information in this article is cited from public media reports, as of October 1, 2026; it is not procurement or investment advice — actual transaction prices follow live supplier quotations.

Who this round covers: from global majors to Taiwan followers

This is not a single-vendor move — it is a transmission chain of "global majors move first, Taiwan makers follow." One key distinction: Taiwan's 10%–15% this round targets non-contract/spot products — customers with long-term contracts face a different impact timeline. Check your contract's price-adjustment clauses before judging the cost hit.

  • onsemi: Securities Times reported (Sept 22) that onsemi has issued a price-increase notice, with new pricing effective October 10, 2026; the company already raised prices once earlier this year. Its stated reasons: persistent increases in raw-material, manufacturing, energy and infrastructure costs, alongside demand growth across power, industrial and data-center applications over the past several quarters. (Securities Times, 2026-09-22)
  • Taiwan-based power makers: supply-chain reports say that after international majors such as Infineon and onsemi adjusted quotations, Taiwan makers are following, with some non-contract (spot) products up ~10%–15% and MOSFETs as the adjustment focus. Named vendors include TSC (台半) and Panjit (强茂); the benefits of TSC's first-half price increase have already materialized, and another round of adjustments is expected in October. (Commercial Times, 2026-10-01; Securities Times, 2026-09-22; STAR Market Daily via EET-China, 2026-09-10; MoneyDJ, 2026-09-22)
  • Renesas: STAR Market Daily reports that Renesas has announced a new round of pricing adjustments effective January 1, 2027; it previously issued a price-increase notice in March that took effect July 1. Renesas cites structural cost increases across raw materials, energy, advanced packaging, manufacturing capacity and global logistics. (STAR Market Daily, 2026-09-10)
  • The wider 2026 picture: Infineon raised prices twice this year (+5%–15% effective April 1 on power switches and related chips; +10%–20% effective July 1 on AI power and automotive power devices); TI launched what STAR Market Daily counts as its fourth price increase since 2025, effective July 1; STMicroelectronics reportedly carried out its third 2026 adjustment on August 23 (TrendForce, citing EE Times China); mainland Chinese makers such as CR Micro (华润微) and Silan (士兰微) have also followed with multiple rounds this year — both raised prices in Q1 and lifted them to over 15% effective July 1. (STAR Market Daily, 2026-09-10; TrendForce, 2026-05-27 and 2026-08-21)

Why MOSFETs move first: three structural reasons

Media and institutional analysis points not to short-term speculation, but to three overlapping structural factors:

  • 8-inch mature-node capacity is being crowded out by AI demand. AI server racks are migrating to 48V and 800V HVDC architectures; the entire conversion chain — from high-voltage distribution down to chip-level power delivery — needs more high-voltage, high-current MOSFETs, IGBTs and PMICs. AI-related demand keeps absorbing 8-inch mature-node capacity, squeezing the capacity available to traditional industrial and consumer applications. (Commercial Times, 2026-10-01; MoneyDJ, 2026-09-22)
  • Limited new capacity for low-/mid-voltage MOSFETs. Bank of America analysis notes that new capacity for low-/mid-voltage power semiconductors including MOSFETs is limited, while global suppliers appear to be reallocating capacity toward higher-value AI/AIDC applications — further compressing supply for traditional industrial customers. (STAR Market Daily citing Bank of America, 2026-09-10)
  • Costs rising across the board. 8-inch wafers, packaging materials, energy and logistics costs keep climbing; supply-chain reports cited by TrendForce say that if AI-related demand keeps crowding mature-node capacity, upward pressure on wafer prices could extend into 2027. (Commercial Times, via TrendForce, 2026-08-21)
  • The bottom line from the Commercial Times: power components are shifting from the past two years of inventory correction toward structural tightness. (Commercial Times, 2026-10-01)

Which parts are hit hardest: a procurement priority list

Ranked by "price-hike certainty × shortage urgency":

  • Low-/mid-voltage MOSFETs (especially the 80V/100V bands named in supply-chain reports): the named focus of this round; TSC's MOSFET shortage is described as "relatively visible." If your BOM includes server PSUs, BBUs, DC-DC converters or Hot Swap MOSFETs, this is your top priority. (Commercial Times, 2026-10-01)
  • Power devices through non-contract/spot channels: Taiwan's round explicitly targets non-contract products — spot prices move first. If you rely on spot top-ups, lock volume now. (Commercial Times, 2026-10-01)
  • IGBT and SiC MOSFET modules: StarPower has raised IGBT and SiC MOSFET module prices by over 15%, and Yangjie Technology raised 10%–15% across its portfolio (STAR Market Daily); AI rack upgrades are also pulling SiC demand. (STAR Market Daily, 2026-09-10; Commercial Times, 2026-10-01)
  • Protection devices and PMICs: AI server power demand is simultaneously pulling protection devices; TI's PMICs are also within the scope of this year's multi-round increases. (Taiwan News, 2026-09-22; TrendForce, 2026-05-27)
  • Lead times: supply-chain reports cited by TrendForce say power-device lead times have stretched (reports cite, with a "reportedly," up to 52 weeks) — always confirm live lead times with suppliers before placing orders instead of scheduling production on historical numbers. (TrendForce, 2026-08-21)
Electronics component warehouse aisle with shelves of reels and cartons in mixed overhead light

Procurement playbook: what to do in the next 30 days

Five moves, in priority order. (Sourceics' MOSFET catalog covers mainstream voltage classes and packages — search by full orderable part number when requesting live pricing and lead times.)

  • Complete your Q4 + 2027-Q1 usage review and RFQs within October. Securities Times reports onsemi's new pricing takes effect October 10, and Taiwan makers are expected to follow in October — so October may be the price-lock window. Renesas's new round effective January 1, 2027 means 2027-Q1 demand should be negotiated now, not in December.
  • Split RFQs by voltage class and package, and state acceptable alternates. List MOSFET demand by voltage band (low/mid/high) and package, note whether pin-to-pin alternates are acceptable, and ask suppliers for two-tier quotes: "spot" vs "forward/contract" pricing. With non-contract products rising first, this shows you which tier is actually cheaper.
  • Contract customers check escalation clauses first; spot customers lock volume first. If you hold annual/long-term agreements, confirm the price-adjustment triggers and notice periods in the contract; if you buy spot, prioritize locking the 80V/100V server-power bands and parts whose lead times have already stretched.
  • Build second-source backup — but don't hard-code alternates. Within the same voltage/current class, add Taiwan and mainland Chinese makers as alternate RFQ targets to hedge single-source risk. Note: whether two specific part numbers are interchangeable must follow the manufacturer's datasheet — never assume substitutability from a matching package alone.
  • Schedule production against worst-case lead times. With power-device lead times stretched, set safety stock for critical MOSFETs against the longest supplier-quoted lead time plus a buffer — not against the average lead times of the past two years.
SMD power devices on carrier tape next to a laptop on a buyer's desk in warm lamplight

Frequently asked questions

Quick answers to the questions buyers ask most during a price-hike cycle.

  • Q: Does this price wave affect only MOSFETs? A: No. MOSFETs are the named focus of this round, but IGBTs, SiC modules, PMICs and protection devices have all seen multiple rounds of increases this year. Review the entire power BOM together rather than looking at MOSFETs alone. (STAR Market Daily, 2026-09-10; TrendForce, 2026-08-21)
  • Q: Will customers with long-term contracts be hit immediately? A: Taiwan's 10%–15% this round mainly targets non-contract/spot products. The impact on contract customers depends on the price-adjustment clauses in their contracts — proactively confirm with suppliers instead of waiting for the invoice. (Commercial Times, 2026-10-01)
  • Q: How long will the increases last? A: Views differ. Commercial Times analysis (via TrendForce) says upward pressure on wafer prices could extend into 2027 if AI demand keeps crowding mature-node capacity; Bank of America expects further increases possible for power devices in the second half of 2026. On the procurement side, planning coverage "at least through 2027 Q1" is the safer stance. (TrendForce, 2026-08-21; STAR Market Daily citing Bank of America, 2026-09-10)
  • Q: Is now a good time to stockpile? A: For firm Q4 and 2027-Q1 demand, getting quotes and locking prices in October is reasonable; speculative hoarding beyond real demand is not advised — power devices went through two years of inventory correction, and when demand wobbles, high inventory gets hurt first.

Manufacturer references

Use the latest guidance for the exact part and manufacturer when deciding acceptance criteria.