STM32H573IIK6 is an STMicroelectronics Arm Cortex-M33 microcontroller with 2 MB Flash, 250 MHz, in UFBGA-176 — for secure connected devices: smart meters, gateways and access control. The TrustZone hardware isolation is the selection point: secure and non-secure code run in separated worlds. Selection advice: the K6 denotes UFBGA-176 in tray — the low-volume variant of the K3QTR tape-and-reel version; pick tray for prototypes and small runs. Confirm fine-pitch BGA assembly capability before committing. ST lists this order code as active; we verify availability per lot. Parameters verified against the ST official product page.
Ordering-code highlights reviewed against official manufacturer documentation.
STM32H573II is available in the following manufacturer order codes. They share the same STM32H573II design; the table highlights package, packing and ordering differences. Quote the exact code your BOM needs.
| Order code | Package | Packing | Key difference |
|---|---|---|---|
| STM32H573IIK3Q | UFBGA | — | — |
| STM32H573IIK3QTR | UFBGA 176+25 10x10x0.6 P 0.65 mm | — | Compared with STM32H573IIK3Q, package and listed temperature grade match, but the order-code suffix differs. Verify the factory packing and PCB footprint before treating order codes as interchangeable. |
| STM32H573IIK6 | UFBGA 176+25 10x10x0.6 P 0.65 mm | — | Compared with STM32H573IIK3Q, temperature grade changes from -40.0 to 125.0 °C to -40.0 to 85.0 °C. Verify the factory packing and PCB footprint before treating order codes as interchangeable. |
| STM32H573IIK6TR | UFBGA 176+25 10x10x0.6 P 0.65 mm | — | Compared with STM32H573IIK3Q, temperature grade changes from -40.0 to 125.0 °C to -40.0 to 85.0 °C. Verify the factory packing and PCB footprint before treating order codes as interchangeable. |
| STM32H573IIT3Q | LQFP 176 24x24x1.4 mm | — | Compared with STM32H573IIK3Q, package changes from UFBGA 176+25 10x10x0.6 P 0.65 mm to LQFP 176 24x24x1.4 mm. Verify the factory packing and PCB footprint before treating order codes as interchangeable. |
| STM32H573IIT6 | LQFP 176 24x24x1.4 mm | — | Compared with STM32H573IIK3Q, package changes from UFBGA 176+25 10x10x0.6 P 0.65 mm to LQFP 176 24x24x1.4 mm; temperature grade changes from -40.0 to 125.0 °C to -40.0 to 85.0 °C. Verify the factory packing and PCB footprint before treating order codes as interchangeable. |
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Browse existing catalog records — same series first, then the same category and manufacturer. These are not confirmed replacements; compatibility requires engineering review.
These are order-code variants of the same STMicroelectronics series. They share the core design; the ordering code selects the exact configuration — STM32H573IIK3Q (UFBGA); STM32H573IIK3QTR: Compared with STM32H573IIK3Q, package and listed temperature grade match, but the order-code suffix differs. Verify the factory packing and PCB footprint before treating order codes as interchangeable.; STM32H573IIK6TR: Compared with STM32H573IIK3Q, temperature grade changes from -40.0 to 125.0 °C to -40.0 to 85.0 °C. Verify the factory packing and PCB footprint before treating order codes as interchangeable.. STM32H573IIK6 itself is the UFBGA 176+25 10x10x0.6 P 0.65 mm configuration. A code that differs by even one character may be a different device, so always quote the complete code exactly as it appears on your BOM.
From the verified technical profile: Core: Arm Cortex-M33; Flash memory: 2 MB; CPU frequency: 250 MHz. These are the catalog-recorded values for STM32H573IIK6 — always re-check them against the manufacturer datasheet revision quoted on your BOM before finalizing the design.