S25HS512TFAMHV013

The ISSI IS25WP256D-RMLE-TR is a 256 Mbit serial NOR Flash on a 1.65 V–1.95 V supply, 104 MHz clock, 16-pin SOIC package, and a wide temperature range of -40°C to +105°C, supplied on tape and reel. The 1.8 V supply is purpose-built for low-power embedded systems: it connects directly to 1.8 V MCUs/SoCs and eliminates level-shifting parts; the -40 to +105°C range suits industrial and in-vehicle infotainment environments. ISSI's official datasheet includes the ordering-part-number nomenclature covering this exact device. Selection advice: compared with the 3 V IS25LP256 series, this is the 1.8 V variant — always confirm the system voltage rail before selecting; the -TR tape-and-reel code is the SMT volume-production option. Parameters verified against ISSI documentation. State quantity, packing and date-code requirements in your RFQ; we reconfirm the offered lot before quotation and reply within 24 hours.

W25Q512JVFIQ is a Winbond 512Mb (64M x 8) Serial NOR Flash in SOIC-16 300mil — the top density for execute-in-place firmware where SPI NAND page management is unwanted: large industrial controllers, networking appliances and automotive gateway modules. 2.7V to 3.6V with SPI/Dual/Quad I/O at up to 133MHz (532MHz equivalent quad), 4KB sectors, 64-bit unique serial number and three 256-byte security registers; DTR and QPI modes available per the JV-DTR datasheet. Selection advice: the FIQ suffix pins the SOIC-16 300mil industrial package — for space-constrained layouts the WSON-8 EIQ code is the smaller twin, and the TFBGA-24 BIQ suits BGA designs; at 512Mb this is the ceiling of economical NOR — beyond it, serial NAND (W25N series on this site) wins decisively on cost per bit. In the current memory tightness, 512Mb NOR faces allocation pressure — confirm lot traceability and require date codes rather than accepting remarked stock. Parameters verified against Winbond documentation. State quantity, packing and date-code requirements in your RFQ; we reconfirm the offered lot before quotation and reply within 24 hours.

GD25Q128ESIGR is a GigaDevice 128 Mbit serial NOR Flash in SOP8 — for code and data storage in industrial control, IoT devices and automotive electronics where a proven 3 V SPI Flash is the default. 133 MHz SPI clock, Quad I/O up to 532 Mbit/s, 4 KB uniform sectors, 2.7 V to 3.6 V operation, and -40 to +85°C industrial grade. Ranked #40 on the 创芯指数 March 2026 hot-search TOP 50 with 12,738 searches, as NOR Flash pricing firms on automotive and industrial restocking. Selection advice: the ESIGR code is the SOP8 208mil reel version with industrial temperature — the EIGR is the commercial-grade alternative; against Winbond W25Q128JV this is the pin-compatible second source most buyers qualify in parallel. Parameters verified against GigaDevice documentation. State quantity, packing and date-code requirements in your RFQ; we reconfirm the offered lot before quotation and reply within 24 hours.

The GigaDevice GD25Q256EFIK is a 256 Mb SPI NOR Flash with a 2.7 V–3.6 V supply, 133 MHz clock, SOP-16 300 mil package, and an industrial temperature range of -40°C to +85°C. It belongs to the same GD25Q family as the in-catalog GD25Q128E (128 Mb), so drivers and instruction sets are compatible — doubling capacity requires no software change; the widely used SOP-16 package keeps second sources easy to find. GigaDevice's official product page marks Status: MP (mass production), and the official datasheet (DS-00526, Rev 1.2), Section 9.1 Valid Part Numbers, lists this exact part number. Selection advice: the direct step-up when 128 Mb is no longer enough; note package/temperature-grade differences versus other GD25Q256E suffix variants (e.g. ESIG) and confirm the suffix when ordering. Parameters verified against GigaDevice documentation. State quantity, packing and date-code requirements in your RFQ; we reconfirm the offered lot before quotation and reply within 24 hours.

GD25Q64ETIGR is a GigaDevice 64Mb (8M x 8) serial NOR Flash in SOP-8 (150mil) - for firmware and code storage in industrial controllers, consumer electronics and telecom equipment. A 2.7V to 3.6V supply with single, dual and Quad SPI up to 133MHz is the selection point: Quad I/O moves boot code four bits per clock, which shortens boot time and frees host-controller pins versus parallel Flash. The business case is density-per-dollar at a mainstream node: 64Mb covers large firmware images with room for A/B update slots, while 100,000 program/erase cycles and 20-year data retention suit field equipment that must run for a decade without rework. Evidence: GigaDevice lists the GD25Q64E base family as MP (mass production) with an official datasheet, and the part carries hardware and software write protection plus program/erase suspend for safe over-the-air updates. Selection advice: the TIGR suffix pins the industrial temperature grade, SOP-8 150mil package and tape-and-reel packing - match the full code to your BOM, since the GD25Q64 family spans multiple packages and the similar GD25Q64C differs in feature set; confirm your host controller supports Quad SPI before assuming the full 133MHz rate, and for 1.8V-only rails specify a 1.8V GigaDevice family instead. Heat basis: Ranked #1 on hqbuy.com real-time hot list (2026-10-15). Parameters verified against GigaDevice documentation. State quantity, packing and date-code requirements in your RFQ; we reconfirm the offered lot before quotation and reply within 24 hours.

MT25QL128ABA1ESE-0SIT is a 128 Mb quad-I/O serial NOR Flash from Micron Technology in an SOP2-8 package, for high-performance embedded storage — firmware images and execute-in-place code. Quad-I/O is the selection point over standard SPI flash: four data lines multiply the read throughput, which shortens boot time and enables execute-in-place without shadowing to RAM. Selection advice: confirm your controller supports quad-I/O mode before specifying this part — in single-SPI mode you pay for speed you cannot use. As firmware-critical flash, require lot and date-code traceability and state whether you need blank or pre-programmed devices in your RFQ. We reconfirm the offered lot before quotation and reply within 24 hours.

MX25L12835FMI-10G is Macronix’s 128-Mbit serial NOR flash — 16M × 8, SPI/QPI up to 104 MHz, 2.7–3.6 V, SOP-16 — for firmware storage and execute-in-place: MCU boot flash, OTA update partitions, and data logging. The ‘-10G’ is the 104 MHz speed grade; the wide 16-SOIC package suits hand-solderable and legacy layouts where fine-pitch packages are unwelcome. Selection advice: this is the tube-packed SOP-16 ordering code — for reel packing quote the /TR suffixed code. For new compact designs check Macronix’s smaller package options for the same die, since 16-SOIC costs board area. QPI quad-I/O roughly quadruples read throughput over standard SPI when the controller supports it — verify the MCU’s QSPI peripheral before counting on the headline speed. Active at distribution. State quantity, packing and date-code requirements in your RFQ; we reconfirm the offered lot before quotation and reply within 24 hours.

The Macronix MX25L25645GMJ-08G is a 256 Mb serial NOR Flash operating at 3 V (2.7 V–3.6 V) and 133 MHz in a 16-pin SOP 300 mil package, with J grade supporting -40°C to +105°C. As the 256 Mb mainstream device of the MX25L family, the large SOP-16 package eases hand soldering and rework for industrial control and power-equipment products with long service lives; the -40 to +105°C range covers outdoor and in-vehicle (non-AEC-Q100) use. Macronix's official datasheet (Rev 1.3, 2026-02), Section 18 Ordering Information, lists this exact part number, and it has been in full production since moving out of Advanced Information in 2020. Selection advice: compared with the in-catalog 128 Mb MX25L12835F, capacity doubles in a package-compatible footprint for a direct upgrade; the 133 MHz clock supports XIP. Parameters verified against Macronix documentation. State quantity, packing and date-code requirements in your RFQ; we reconfirm the offered lot before quotation and reply within 24 hours.

The Winbond W25Q01JV is the highest-capacity device in the W25Q serial NOR Flash family at 1 Gbit, built on a uniform 4 KB sector architecture with Dual/Quad SPI interfaces running up to 133 MHz, a 2.7 V–3.6 V supply range, and an industrial temperature range of -40°C to +85°C. As the flagship capacity of the series, a single chip carries the full 1 Gbit of code storage, simplifying the BOM and PCB layout versus multi-chip cascaded schemes; the uniform 4 KB sectors make erase management finer and firmware upgrades more flexible, while high-speed Quad SPI read supports execute-in-place (XIP) and code shadowing for shorter system boot times. Winbond lists the device as Status=P (in production), so supply is stable for long-lifecycle industrial control, networking, and smart-terminal projects. Selection advice: if code size exceeds 512 Mb but has not reached multi-gigabit territory, the W25Q01JV is the direct step-up from the W25Q512JV with no interface change; note it is a 3 V device — 1.8 V low-power systems should pick a 1.8 V series instead; space-constrained designs can choose the TFBGA-24 6×8 mm package. Parameters verified against Winbond documentation. State quantity, packing and date-code requirements in your RFQ; we reconfirm the offered lot before quotation and reply within 24 hours.

The Winbond W25Q02JVTBIM is a 2 Gbit (256 MB) QSPI NOR Flash built on a stacked four-die × 512 Mbit architecture, with uniform 4 KB sectors, Standard/Dual/Quad SPI plus DTR (double transfer rate) modes, clocks up to 133 MHz (532 MHz equivalent in Quad mode), a 2.7 V–3.6 V supply, an industrial temperature range of -40°C to +85°C, and a 24-ball TFBGA 8×6 mm package. As the largest-capacity device in the W25Q family, a single chip covers large-code applications such as complex GUIs and OTA dual-image backup without external storage; DTR doubles effective throughput, so code shadowing and XIP run more smoothly. Winbond's official W25Q02JV datasheet (RevD, DTR) lists this exact part number in the ordering table as a valid in-production device. Selection advice: it is the direct step-up from the 1 Gb W25Q01JV with an interface-compatible footprint; note it is a 3 V device; the TFBGA package suits high-density layouts. Parameters verified against Winbond documentation. State quantity, packing and date-code requirements in your RFQ; we reconfirm the offered lot before quotation and reply within 24 hours.

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